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sandisk2019校园宣讲会
四川大学
举办地点 成都电子科技大学(沙河校区)二教楼101&201&212
信息来源 四川大学毕业生就业网
更新时间 2024-04-17 19:13
宣讲时间 2014-10-18 10:00
宣讲会介绍
SanDisk 2015 校园招聘
公司简介
SanDisk是全球最大的闪存存储解决方案提供商。我们的产品帮助您拍摄、分享、保存和欣赏精彩的数码世界。无论是相机中使用的移动存储卡、随身携带的智能手机,还是提供云计算服务的数据中心,SanDisk都可以通过随时随地的数据存储丰富人们的生活。
从1988年在美国硅谷创立,到1995年于纳斯达克上市,到2011年跻身美国财富500强,24年中SanDisk始终坚持创新,超越。目前SanDisk在全球拥有超过3000项专利。我们发明了大容量闪存存储卡,在 USB 驱动器领域走在最前列,并且开发了先进的闪存技术,为二十年时间里闪存成本降低50,000 倍做出了贡献。现在,我们的每单元存储三位数据 (X3) 技术、先进的架构和其它闪存创新技术正在支持着新型产品。
SanDisk在世界一流的制造厂中生产变革性的存储产品,每年闪存芯片的产量数以亿计。为了满足客户对闪存不断增加的需求,SanDisk于2005年开始在上海紫竹科技园设立全球唯一的封装测试工厂,在这里,我们利用经济高效的大产量制造和装配技术每天生产 200 多万个闪存产品。 我们与东芝公司合作运营着几处世界上最大、最先进的 NAND 闪存制造工厂,并且挑战性能极限,开发高效的新一代技术,如19 纳米(nm) 技术。
在SanDisk,我们崇尚“创新,超越,灵活,协作,诚信”的核心价值;在 SanDisk,我们相信企业社会责任(CSR)是企业整体成功的一个重要因素;在SanDisk,我们为员工提供有竞争力的薪酬待遇、快速的成长环境和广阔的发展空间。
欢迎加入SanDisk,加入闪存世界的No.1!
联系我们
公司地址:上海市闵行区江川东路388号
公司网址: http://www.sandisk.com
网申地址:http://campus.51job.com/sandisk
SanDisk招聘官方微博:@SanDisk人才招聘
地点 | 学校 | 时间 | 地址 |
上海 | 上海大学 | 10月14日周二 12:00-18:00 | 上海市宝山区南陈路333号上海大学东区材料学院副楼五楼526会议室 |
上海交通大学 | 10月21日周二 12:00-18:00 | 上海交通大学闵行校区(待定) | |
复旦大学 | 11月 2日周日 12:00-18:00 | 复旦大学邯郸校区恒隆物理楼1楼138 | |
成都 | 成都电子科技大学 | 10月18日周六 10:00-16:00 | 成都市建设北路二段四号沙河校区二教楼101 & 201 & 212 |
西安 | 西安电子科技大学 | 10月25日周六 14:00-18:00 | 西安电子大学北校区西大楼415 & 416 |
浙江 | 浙江大学 | 11月 7日 12:00-18:00 | 玉泉校区计算机学院201 & 208 & 214 |
SanDisk开放日(第一场) | 11月11日 9:00-17:00 | 上海市闵行区江川东路388号 | |
SanDisk开放日(第二场) | 11月13日 9:00-17:00 | 上海市闵行区江川东路388号 |
职位介绍
R&D
1. Test Development Engineer - (Java/C Programming)
Job Description:
1. In this position, the individual will assist in the debugging and development of NAND KGD, BI and MT test programs for automated test systems.
2. Full-automated test cell with tester and device handler, developing characterization and evaluation programs for new products and supporting failure analysis on test systems.
3. The individual will also be responsible for Java or C programming to debug software/ hardware in assembly and communicate clearly with various engineering departments.
Education/Experience Requirement:
1. Bachelor or Master Degree in Electronic, Automation, Computer Science or related major.
2. Strong Java or C programming skills, excellent debugging practices and the ability to write programs according to design documents and data sheets.
3. Proficiency in oscilloscopes, logic analyzers, and meters in the lab is a plus.
4. Ability to achieve results in a fast moving, dynamic environment.
5. Excellent English communication (written and verbal) and interpersonal skills
2. Product Engineer – (Memory Test)
Job Description:
1. Be responsible for packaged flash memory test program development, units failure analysis and device issue debug
2. Be responsible for NAND Product and Package Quality / Reliability tests setup / EFA / Action Plan.
3. Providing correct test condition for the memory product and generate defined test flow for volume testing needs
4. Product Evaluation DOE for Reliability / DPPM improvement and D/S and KGD Sort Yield improvement.
5. Run the test time analysis to get a lowest cost test method in order to reach short test time and high testing coverage
6. Define / improve testing method to deal with new product introduced to mass production and marketing
7. Deliver a world class throughput time on the testing code development to reach the most effective way of sample delivery TPT (Through Put Time)
8. Work with multinational team to complete assigned projects in PDT (product development team) required time.
Education/Experience Requirement:
1. Require Bachelor degree and above in Electronics Engineering, Automation, Microelectronics or related major.
2. Require familiarity with common lab equipment such as digital scope, logic analyzer, and multi-meter.
3. Require good written and verbal English.
4. Require good communication skills with other groups.
3. Product Engineer – (System Test)
Job Description:
1. Perform NAND memory (wafer-level/unit-level) design validation, characterization and qualification, using ATE tester.
2. Perform test program check-out and release to manufacturing.
3. Perform card-level product validation, characterization and qualification, using ATE tester.
4. Perform low yield analysis on issues related to circuit design, product defect, and manufacturing excursion.
5. Perform Electrical Failure Analysis on wafer-level/unit-level/card-level for Yield improvement, EDDPM reduction and test time reduction.
6. Prepare the validation/characterization/qualification report.
7. Monitor Key Product Indicators of manufacturing line. Help manufacturing engineers to solve technical issues.
Education/Experience Requirement:
1. Require Bachelor degree and above in Electronics Engineering, Automation, Microelectronics or related major.
2. Require familiarity with common lab equipment such as digital scope, logic analyzer, and multi-meter.
3. Require good written and verbal English.
4. Require good communication skills with other groups.
4. Test Development Engineer - (C++/C Programming)
Job Description:
1. Design, develop, and implement Test System to test Company Flash Products, including OOP SW, Tester Interface, Device Drivers, Database, etc.
2. Involve in SW Development Life Cycle including Requirement Definition, System Design, Development, Integration and Testing.
3. Troubleshoot Test Solutions and New Products with Hardware, Product and Firmware Teams across sites. It involves understanding of device protocols, Software and Hardware debugging tool such as Multimeters, logic analyzers.
Education/Experience Requirement:
1. Bachelor degree in Computer Science/Electrical Engineering or equivalent
2. OOP concepts, Strong C/C++ programming skills, Scripting and Database knowledge is a plus
3. Experience with hardware debugging tools such as multi-meters and logical analyzers
4. Self-motivated and willing to learn
5. Excellent English communication (written and verbal) and interpersonal skills
5. Packaging Design Engineer
Job Description:
1. Execute substrate design including LGA, BGA and new product.
2. Substrate design review.
3. Design flow enhancement.
4. Design library maintenance.
5. Design rule collection and maintenance.
6. Coordinator of subcon/substrate supplier related to substrate design.
7. Substrate Strip Design.
8. Substrate supplier Gerber file review.
9. Tooling Design/Review.
Education/Experience Requirement:
1. Require Bachelor degree and above in Packaging, Mechanical Design, Materials or related major.
2. Good knowledge on Packaging engineering and designing.
3. Good knowledge on computer, windows, office, Understand CADENCE, KM 350, CAD, SOLIDWORD 3D related DWG software.
4. Ability to achieve results in a fast moving, dynamic environment.
5. Ability to troubleshoot and analyze complex problems.
6. Ability to multi-task and meet deadlines.
7. Excellent English communication (written and verbal) and interpersonal skills.
6. Packaging Development Engineer
Job Description:
1. Develops new package requirements and maintains quality of existing packages for all product groups.
2. Defines package requirements for product groups and customer requirements.
3. Develops new package and process qualification programs. Using appropriate tools; performs integrity analysis of packages.
4. Performs package characterizations including cost effectiveness studies.
5. Acts as a liaison with vendors.
6. Maintains product quality while developing and introducing package cost reduction programs.
7. Coordinates the introduction of new package processes into production.
8. Prepares and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies.
Education/Experience Requirement:
1. Require Bachelor degree and above in Packaging, Mechanical Design, Materials or related major.
2. Good knowledge on Packaging engineering and popularly Science.
3. Good knowledge on computer, windows, office, and understand database is better.
4. Ability to achieve results in a fast moving, dynamic environment.
5. Ability to troubleshoot and analyze complex problems.
6. Ability to multi-task and meet deadlines.
7. Excellent English communication (written and verbal) and interpersonal skills.
7. Reliability Engineer
Job Description:
1. This person will work in Reliability lab to perform Reliability Test on Production excursion evaluation or Package Qualification.
2. Need to study and set up the usage model for new package/product based on experiment data collection and analysis.
3. Need to work with packaging design team and process engineering team to define reliability test plan and sampling criteria.
4. Need to Maintain and develop the reliability test procedure, manage the rel test schedule and follow up the test result.
5. Need to work with FA Eng to perform 1st level validation and failure analysis for reliability test failures.
6. Understand the failure mode for process/package characterization.
Education/Experience Requirement:
1. Bachelor degree in Semiconductor / Material Science / Micro-electronics.
2. Willing to assume accountability. Willing to take challenge.
3. Good communicate skills. Good teamwork spirit. Quick learning ability.
4. Fluent English, reading and writing.
5. IC product technology. IC semiconductor assembly process.
6. Rel monitor process and sampling methodology.
7. IC life time requirement and acceleration factor methodology.
MFG
8. Product Engineer - (Wafer Test)
Job Description:
1. Provide production support engineering for specific product or group of products after transfer from development to high volume production.
2. Responsible for test program buy-offs and product qualification related to test.
3. Responsible for Failure Analysis for product yield improvement and meeting yield and quality target.
4. Sustain products with cost reduction and yield improvement.
5. Responsible to work with SDUS PE and Asia TE to drive test time reduction.
6. Implement and support daily activities on hold lot dispositions from low yield and QA reject
Interface with SDUS Product engineering, and various engineering teams in Asia to solve problems.
Education/Experience Requirement:
1. Bachelor degree in Electrical or Electronic Engineering or relevant above. Master or PhD preferred.
1. Good knowledge on CMOS and Electronic circuits.
2. Understand C/C++ language is a plus
3. Ability to achieve results in a fast moving, dynamic environment.
4. Ability to troubleshoot and analyze complex problems.
5. Ability to multi-task and meet deadlines.
6. Excellent English communication (written and verbal) and interpersonal skills.
G&A
11. Accounts Receivable Accountant
Job Description:
Reporting to the Revenue Manager, the individual will be responsible for uploading invoices to customer portals, support/back up for customer master data set-up, APAC channel revenue and sample order finance review process. The individual will also work closely with Credit & Collections group to respond to inquiries from customers. This position will support various AR and Revenue functions.
Primary Responsibilities:
1. Enter customer invoices into customer portal
2. Respond to invoicing inquiries and requests
3. Resolve issues related to A/R and revenue
4. Back up for customer master data set-up
5. Support APAC channel revenue recognition
6. Support sample order finance review process
7. Assist Manager with ad hoc tasks as assigned.
Education/Experience Requirement:
1. This position requires a Bachelor’s degree in Finance or Accounting.
2. An excellent written and verbal communication skill in English is a must.
3. Attention to detail is critical, as well as the ability to prioritize responsibilities, learn quickly.
4. High integrity, team work spirit, stable and be able to work under pressure.
5. Self-motivated, discipline, has ability to settle the problem independently.
6. Ability to work in a fast paced and dynamic environment.
7. A proficient Microsoft Excel and Power Point skill is a plus.
8. Leadership in Student Union activities is a plus.
12. HR Representative
Job Description:
1. Welfare management and dispatched
2. Award card management and dispatched
3. Festival card management and distribution
4. Stationary and office supplier management (coffee/tea/paper/tonner/snack…)
5. Plant and courier management
6. Employee communication and activity
Education/Experience Requirement:
1. Require Bachelor degree and above in Psychology, English, Human Resources or related major
2. Good English for both written and oral
3. Good PPT skill or video edit skill
4. Good communication skill with other groups
13. Staffing Representative
Job Description:
1. Data analysis and integration from internal system and support to make report such as PPT, pivot table;
2. Support on campus branding & recruiting activities;
3. Job posting on internal and external job board, basic qualification screen for relevant jobs.
4. Support on interview arrangement and meeting organization including interviewee pick-up, forms filling and meeting room reserving.
5. Be in charge of new hire’s background check, contacting vendor for new hire data updating, contract and payment management.
6. Other works assigned by manager.
Education/Experience Requirement:
1. Bachelor/Master Degree, major in Psychology, English, Human Resources, Computer Science, Information preferred.
2. Strong MS Office skills.
3. Good English for both verbal and writing.
4. Proactive working attitude and adaptability for a quick moving environment.
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